|Thermal Conductivity||>1.93 W/m-K|
|Thermal Impedance||<0.225 °C-in²/W|
|Specific Gravity||>2 g/cm³|
|Thixotropic Index||380±10 1/10mm|
|Moment Bore Temperature||-50~300 °C|
|Operation Temperature||-30~280 °C|
|Ingredients||Silicone Compounds = 50%
Carbon Compounds = 30%
Metal Oxide Compounds = 20%
How to Use
- Clean the CPU and heat sink surfaces, Wipe the surface lightly with a cotton ball or cotton swab dampened with alcohol or our thermal cleanser.
- Place a tiny drop of thermal grease to the center of the cooler base, smear it evenly with scraper or finger cot, best thickness is 0.13~0.15mm.
- Attach the heat sink to the processor and Avoid removing the heat sink after installing it.