Description
| Model | HY510 |
| Color | Grey |
| Thermal Conductivity | >1.93 W/m-K |
| Thermal Impedance | <0.225 °C-in²/W |
| Specific Gravity | >2 g/cm³ |
| Viscosity | 1000 |
| Thixotropic Index | 380±10 1/10mm |
| Moment Bore Temperature | -50°C~300°C |
| Operation Temperature | -30°C~280°C |
| Ingredients | Silicone Compounds = 50% Carbon Compounds = 30% Metal Oxide Compounds = 20% |
| Certification |   |
Feature:
- Clean the CPU and heat sink surfaces, Wipe the surface lightly with a cotton ball or cotton swab dampened with alcohol or our thermal cleanser.
- Place a tiny drop of thermal grease to the center of the cooler base, smear it evenly with scraper or finger cot, best thickness is 0.13~0.15mm.
- Attach the heat sink to the processor and Avoid removing the heat sink after installing it.
